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advanced packaging equipment and wafer level bumping services skip to content search for home information about pactech events exhibitions press release career jobs publications locations certificates media library equipment by process laser soldering laser assisted bonding electroless plating solder ball mounting wire soldering by application 3d and 3 5d packaging flip chip probe card reballing smt by sector aerospace automotive consumer electronics energy and solar medical production and assembly product family sb² laplace ultra sb² pacline wlp service electroless plating electroless plating maskless chemical deposition of metal stacks on wafers as intermetallic connection or to enhance product reliability electroplating electroplating is the process of using electrodeposition to coat an object in a layer of metal s on any substrate copper pillar electroplated cu pillar with optional ni diffusion barrier and snag cap for low cost and fine pitch flip chip interconnects redistribution layer rdl rerouting of pads on a die with metal and dielectric layers to the other locations to fulfil the subsequent packaging rules solder balling various solder deposition technologies to form solder bump for wafer level chip scale packaging and flip chip interconnects laser asssisted bonding laser assisted bonding is an interconnection method performed through the laser energy to bond two surfaces of materials together wafer level component assembly we offer wafer level component assembly by attaching dies chips or various passive components like capacitors on a wafer surface wafer thinning removal of wafer backside materials for thinner die in final packaging via high quality mechanical polishing and chemical stress relief wafer metal coating application of various metal stacks via evaporation or sputtering technologies on wafer backside for better die performance wafer dicing wafer dicing is the process where silicon chips die are separated from each other on the wafer accomplished by mechanically sawing chemicals contact contact global sales team customer center english deutsch german 日本語 japanese 한국어 korean 简体中文 chinese simplified 繁體中文 taiwanese home about about pactech events exhibitions press release career jobs publications locations certificates media library equipment by process laser soldering laser assisted bonding electroless plating solder ball mounting wire soldering by application 3d and 3 5d packaging flip chip probe card reballing smt by sector aerospace automotive consumer electronics energy and solar medical production and assembly product family sb² laplace ultra sb² pacline wlp service electroless plating electroplating copper pillar redistribution layer rdl solder balling laser asssisted bonding wafer level component assembly wafer thinning wafer metal coating wafer dicing chemicals contact contact global sales team customer center english deutsch german 日本語 japanese 한국어 korean 简体中文 chinese simplified 繁體中文 taiwanese search for home pia bubelt 2026 08 10t04 38 13 02 00 advanced packaging equipment wafer level packaging services precision semiconductor packaging starts here explore our solutions advanced packaging equipment wafer level packaging services precision semiconductor packaging starts here explore our solutions pioneering excellence in advanced packaging equipment and wafer level packaging service learn more about our commitment to precision innovation and quality in semiconductor manufacturing this short film offers an inside look into pactech s global operations technologies and the values that drive our engineering excellence sorry your browser doesn t support embedded videos pioneering excellence in advanced packaging equipment and wafer level packaging service learn more about our commitment to precision innovation and quality in semiconductor manufacturing this short film offers an inside look into pactech s global operations technologies and the values that drive our engineering excellence sorry your browser doesn t support embedded videos products services advanced packaging equipment discover our revolutionary advanced packaging equipment for automated and high precision manufacturing learn more wafer level packaging services engage with us for highly customized wlp services with our line up of edge leading capabilities installed learn more high tech chemicals for wlp we are supplying complete plating solutions to our customers for a guaranteed process transfer learn more products services advanced packaging equipment discover our revolutionary advanced packaging equipment for automated and high precision manufacturing learn more wafer level packaging services engage with us for highly customized wlp services with our line up of edge leading capabilities installed learn more high tech chemicals for wlp we are supplying complete plating solutions to our customers for a guaranteed process transfer learn more products services advanced packaging equipment discover our revolutionary advanced packaging equipment for automated and high precision manufacturing learn more wafer level packaging services engage with us for highly customized wlp services with our line up of edge leading capabilities installed learn more high tech chemicals for wlp we are supplying complete plating solutions to our customers for a guaranteed process transfer learn more about pactech pactech is a global leader in advanced packaging equipment and wafer level packaging services trusted by semiconductor manufacturers worldwide headquartered in germany and backed by the nagase group we bring more than 30 years of precision engineering innovation and customer commitment to every solution we deliver 0 global locations germany usa malaysia 0 machines delivered 0 granted patents learn more about us about pactech pactech is a global leader in advanced packaging equipment and wafer level packaging services trusted by semiconductor manufacturers worldwide headquartered in germany and backed by the nagase group we bring more than 30 years of precision engineering innovation and customer commitment to every solution we deliver 0 global locations germany usa malaysia 0 machines delivered 0 granted patents learn more about us upcoming event view full 2026 schedule upcoming event view full 2026 schedule newsletter navigation jobs press release contact locations imprint terms conditions privacy policy cookie policy pactech packaging technologies gmbh 2012 2025 all rights reserved member of nagase group linkedin youtube page load link manage cookie consent to provide the best experiences we use technologies like cookies to store and or access device information consenting to these technologies will allow us to process data such as browsing behavior or unique ids on this site not consenting or withdrawing consent may adversely affect certain features and functions functional functional always active the technical storage or access is strictly necessary for the legitimate 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