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optifly raith sectors by enabling a wide variety of applications for industry and academia we enable building their digital future explore how nanotechnology enables your business optical telecommunication consumer electronics research rapid prototyping semiconductors defense space quantum technologies materials science life sciences our insights photonics sectors solutions our nanofabrication solutions pave the way from breakthrough innovations and rapid prototyping to volume production of nanotechnology devices patterning digital raith mix and match holography workflow process control solutions products our unique combination of high precision writing imaging and analysis tools is designed to meet the most demanding requirements in the field providing unparalleled precision and efficiency electron beam lithography focused ion beams laser lithography imaging analysis explore electron beam lithography the crucial technology for generating nanostructures essential in shaping tomorrow s devices particularly in semiconductors optoelectronics and quantum technologies product overview ebpg highest throughput automation and precision voyager high performance for shortest time to result pioneer e line raith150 multifunctional system family for maximum versatility elphy upgrade kit for sem or fib sem experience ion beams across various fields with our fib sem nanofabrication ion microscopy and sims nanoanalytics systems product overview velion multi ion species fib sem ionmaster sims analysis for high resolution nm scale elemental mapping elphy upgrade kit for sem or fib sem discover laser lithography with multi beam technology for enhanced throughput and scalable resolution or choose single beam systems with unmatched lateral and gray level resolutions product overview picomaster direct laser writers with ultimate resolution picomaster xf highest throughput grayscale lithography athos light years ahead in optical security and holographic packaging explore precise imaging and analysis tools for enhanced understanding and progress offering a wide range of capabilities from large area 3d imaging to comprehensive process control and extensive material analysis product overview chipscanner large area 3d sem imaging ionmaster sims analysis for high resolution nm scale elemental mapping vector ai powered inspection and metrology electron beam lithography ebpg voyager pioneer e line raith150 elphy focused ion beams velion ionmaster elphy laser picomaster picomaster xf athos imaging analysis ionmaster chipscanner vector products technologies we continually push the boundaries of nanotechnology a commitment we take very seriously over the past four decades our intense focus and dedication have led to numerous groundbreaking innovations exploring the depths of nanotechnology ultrapositioning ionselect smartmotion magsims perfectshapes fasthr autorun proimage optifly infinitrace easyswitch rapidtrace holosuite technologies services the worldwide sales and service structure is backed by dedicated experts in our international application and development centers global departments and local factories work hand in hand service contracts services contacts updates upgrades service on demand service contact form services company we are a global nanotech solutions provider defined by progress about us career downloads vision mission news micrograph award sustainability events contact us locations representatives references company search login contact opti fly to tackle uneven and other types of non flat substrates a robust precise and high speed autofocus system is necessary meet optifly technology for laser beam lithography raith technologies optifly introduction optifly technology overcomes substrate imperfections during lithography by maintaining constant focus its high speed autofocus system enables the objective lens to keep focus on challenging substrates even at high scan speeds ensuring precise exposure despite uneven coatings and warpage precision speed and adaptability key features high precision focus capture with an optical detection limit of 10 nm of height variation our autofocus af system ensures that the focus is captured to a high level of precision this allows for accurate automatic alignment of the uv laser spot to the substrate high bandwidth measurement with a high speed measurement system we can track the substrate height variations in real time the distance between different measurement positions along the scan axis are dependent on the scan speed and can vary from a few microns to sub micron this distance range can account for typical coating and substrate height variations hybrid autofocus strategy the closed loop controlled encoded actuation of the lens with a high resolution allows the lens position to be tracked and precisely controlled to take advantage of this capability a height map of the exposure area is captured before each job if the optical autofocus signal is lost for any reason during exposure the system reverts back to the initial height map and uses the interpolated lens for exposure without losing the focus benefits for applications the optifly advantage unmatched precision and reliability in laser lithography achieving optimum resolution over large areas consistent cut off resolution of a tool can only be achieved if every single step of the process is flawless this starts with precise alignment of the uv laser beam along the z axis on the resist however this is not enough the focus must be maintained at all times if we are to write the large area patterns required by modern applications fine placement of the focal plane enables advanced processing precise placement of the uv laser spot within the resist layer is critical for writing the best resolution features further control of the placement of focal plane at the top of the resist surface within the resist layer and at the resist substrate interface is critical for controlling the resist side wall profile for various applications adapting to the substrate type and topography our lbl tools address a wide range of applications from advanced semiconductor processing and quantum computing chips to high security holographic printing our optifly technology adapts to diverse substrates including transparent absorptive reflective or structured surfaces even with significant height variations by integrating optical and electronic control paradigms structured wafers optifly technology allows not only wafer scale changes such as warpage and bow to be handled but also higher frequency topographies such as pre existing structures e g metal lines on a sapphire wafer we can track 300 µm of height differences over a full wafer by using various strategies to capture and utilize substrate height maps and optical autofocus signals together with the ability to control the red laser power the picomaster can address the challenges posed by these complex substrates how it works inside optifly the hybrid autofocus revolution in laser lithography astigmatic autofocus strategy the first part of our optifly technology depends on an astigmatic autofocus af strategy our laser beam lithography lbl systems use a collinear red laser that is co focused at the same plane as the writing laser through the objective lens the autofocus beam is designed to be astigmatic so that the focused spot is circular only at the point of focus when it is defocused it becomes elliptical and rotates the reflected red laser is collected through the objective lens and projected onto a segmented quadrant photodiode qpd by using the voltages generated across the photodiode quadrants when the beam is defocused the system can precisely determine the location of the focus and align the laser with an optical detection limit of 10 nm the system takes 30 thousand measurements of the focus position every second during the exposure that is one measurement for every 15 microns of substrate length at the highest scan speed roughly 1 6 th the width of an average human hair figure 1 astigmatic af principle a red laser spot is focused onto the same plane as the writing uv laser the reflected image of the spot is projected onto the qpd if the laser is in focus the projection appears circular and all the quadrants generate the same voltage if the laser is defocused the image becomes elliptical and creates voltage differences across the opposing diagonal quadrants this difference can be detected and used for capturing and maintaining the focus the hybrid autofocus technology the improvement of optifly technology over existing af systems whether optical or air pressure gauge based is based on our hybrid approach to the af challenge which creates a more robust system than its counterparts the strength of this hybrid af technology stems from a sensor fusion approach that combines the signals from precise lens position measurement by an optical encoder with the optical af signal measured by the qpd when combined with a closed loop controlled lens actuator that can track and control the lens position this approach yields a highly robust dynamic af system architecture that can handle a broad variety of substrates and edge cases the starting point involves capturing a height map of the exposure area at the beginning of each job in the job list queue if the optical signal is lost due to a discontinuity e g a particle coating defects trenches vias substrate edges etc during exposure the optifly system then takes over and adopts the estimated lens location based on the initial height map until the optical signal is recovered this technology allows us to overwrite native discontinuities such as existing structures on the substrate and over the edges as well as overwriting undesired features such as particles and defects without complete loss of focus use case optifly technology supports precise and stable lithography on large substrates such as complex wafers with structured surfaces or discontinuities and substrates that present challenges such as bowing warpage or domed surfaces offering advanced autofocus and distortion compensation this system ensures consistent focus across varying topographies in addition picomaster systems featuring optifly technology excel in exposing small chiplets as small as 5 mm wide or potentially even smaller thanks to their porous chuck option that maintain high accuracy without any risk of surface contact or loss of focus this robust performance makes the technology ideal for handling intricate non planar substrates it supports precision lithography across challenging surfaces while maintaining the speed and reliability required for industrial scale applications application use cases photomasks metal layer on glass as highly reflective substrate blazed gratings thick resists on glass ultra deep grayscale lithography on highly absorbing resist layers experience optifly picomaster xf highest throughput grayscale lithography picomaster direct laser writers with ultimate resolution athos light years ahead in optical security and holographic packaging need support for a specific application consult an expert want to experience our system first hand request a demo sign up for our newsletter hp name submit contact us send a message follow us on social media sectors optical telecommunication semiconductors quantum technologies consumer electronics life sciences defense space materials science photonics research rapid prototyping solutions patterning mix and match process control digital raith holography workflow products electron beam lithography focused ion beams laser lithography imaging analysis legal notice impressum privacy policy datenschutzerklärung 2024 raith gmbh headline this is a basic text element headline this is a basic text element close search advanced search any post type downloads events insights jobs pages posts products references sectors solutions technologies popular searches career downloads ebpg voyager