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semiconductor engineering deep insights for chip engineers submit subscribe home systems design low power high performance manufacturing packaging materials test measurement analytics auto security and ai special reports business startups jobs knowledge center technical papers home ai ml dl architectures automotive aerospace communication data movement design verification lithography manufacturing materials memory optoelectronics photonics packaging power performance quantum security test measurement analytics tech papers transistors z end applications events webinars events webinars videos research videos industry research newsletters store newsletters store menu home special reports systems design low power high performance manufacturing packaging materials test measurement analytics auto security and ai knowledge center videos startup corner business startups jobs technical papers events webinars industry research newsletters store special reports home welcome to semiconductor engineering special reports validation gets tested at 1kw by gregory haley kilowatt class ai accelerators are forcing engineers to rethink what counts as adequate coverage across workload thermal behavior test hardware and multi die assemblies dominate at 2nm and below by ed sperling chips are getting bigger more modular and much more capable as new innovations mix with existing processes and long researched projects cfets forge better connections by laura peters performance advantage may come down to material choices and precise interconnect decisions more top stories when ai agents cross chip design silos specialization and orchestration are becoming more important as the role of ai agents i september 24th 2026 by ed sperling eda s future is evidence driven automation ai may accelerate semiconductor design but users still need formal proof semantic con september 24th 2026 by ann mutschler 3d chips push eda into new territory as ai chips move to stacked chiplet based architectures eda vendors are reworking mat september 24th 2026 by liz allan multi agent ai systems must work like an orchestra without a conductor a mixture of expert agentic ai systems can focus on their tasks with or without a comma september 23rd 2026 by liz allan how robotics and intelligent equipment control drive next gen fab productivity behind the scenes advanced equipment control and robotics are enabling higher levels o september 21st 2026 by laura peters why package digital twins are so hard to build models need to be synchronized with what manufacturing actually builds september 17th 2026 by gregory haley negative expansion materials resist warpage molding compounds and underfill can improve thermal stability september 17th 2026 by bryon moyer the silicon heartland wants to be america s next chip powerhouse intel may be the marquee name but materials suppliers packaging hubs and quantum sta september 17th 2026 by brendan heffernan ai data centers have a stranded power problem redundant feeds protect uptime but they also strand capacity that could support more h september 15th 2026 by bryon moyer hardware software co design in the ai era even though the benefits are accepted a combined hardware software development flow is september 15th 2026 by brian bailey scaling thermal analysis from transistors to data centers rising power density and chiplet complexity drive thermal considerations earlier in the september 15th 2026 by ed sperling redefining processes at sub 2nm discrete steps are being merged with others as dimensions shrink into the angstrom range september 10th 2026 by ed sperling silent data errors redefine test coverage and fleet maintenance strategies through better manufacturing screening dft for systems and fleet monitors this major september 10th 2026 by laura peters token costs are becoming the new eda budget battle cost per token is causing eda design budgets to balloon what comes next isn t entirely september 9th 2026 by liz allan humanoid compute security more complex than avs robots and autonomous vehicles are both edge devices but a humanoid has wheels as well september 3rd 2026 by liz allan ai is forcing data centers to rethink trust exploding compute demand is exposing new gaps across the hardware supply chain from ch september 3rd 2026 by brendan heffernan what can go wrong in 800vdc ai data centers sparks and fires caused by higher electrical currents can cause costly outages and put september 3rd 2026 by liz allan security sign off is coming for chips but standards may not be enough as ai post quantum cryptography chiplets and custom silicon expand the attack surfac september 2nd 2026 by ann mutschler photonics forces a chiplet rethink thermal drift stress electromagnetic coupling and verification gaps are turning opti august 31st 2026 by ann mutschler issues stack up with more hbm layers hot chips 2026 thinner dies more tsv area thermal dissipation and limited manufactu august 27th 2026 by ed sperling more top stories latest news chip industry week in review ai agents move deeper into chip design china doubles down on ai compute and memory chip supply chains tighten for equipment and critical materials tsmc partner september 25th 2026 by the se staff blog review sept 23 digital twins and thermal sensors agentic ai workflows physical ai needs new silicon rf design changes september 23rd 2026 by jesse allen chip industry week in review major memory deal ai infra summit news u s chip capacity plans 2nm below advances huawei s chip offensive rot solution for data centers and ai socs chine september 18th 2026 by the se staff more news opinion can gpus continue to dominate ai compute google amazon and now openai have competitive offerings and september 9th 2026 by geoff tate the imec report advancing the cfet based device roadmap part i novel integration modules and standard cell configurat september 1st 2026 by cassie sheng more opinions research chip industry technical paper roundup sept 22 ai thermal modeling for 2 5d 3d ics chiplet and ai accelerato by linda christensen chip industry technical paper roundup sept 14 heterogeneous memory chiplets for multi request llm inference by linda christensen research bits sept 8 carbon insulator for interconnects high temperature sic jfets by jesse allen more research startup corner startup funding q2 2026 plenty of cash for ai and its enablers 80 startups raise over by jesse allen startup funding q1 2026 massive rounds for ai eda and manufacturing 80 startups rai by jesse allen more startups videos moving test data faster september 16th 2026 the intersection of ai and voice at the edge september 9th 2026 smart outlier detection september 8th 2026 redefining roles for edge and cloud ai august 25th 2026 knowledge centers entities people and technologies explored learn more about about us contact us advertising on semieng newsletter signup navigation homepage special reports systems design low power high perf manufacturing packaging materials 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