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system in a package wikipedia 116 captures 10 jun 2020 17 sep 2026 sep oct nov 16 2021 2022 2023 success fail about this capture timestamps the wayback machine http web archive org web 20221016130935 https en wikipedia org wiki system_in_a_package system in a package from wikipedia the free encyclopedia jump to navigation jump to search this article or section may contain misleading parts please help clarify this article according to any suggestions provided on the talk page november 2007 this article needs additional citations for verification please help improve this article by adding citations to reliable sources unsourced material may be challenged and removed find sources system in a package news newspapers books scholar jstor february 2014 learn how and when to remove this template message a sip multi chip which contains a processor memory and storage on a single substrate a system in a package sip or system in package is a number of integrated circuits enclosed in one or more chip carrier packages that may be stacked using package on package 1 the sip performs all or most of the functions of an electronic system and is typically used inside a mobile phone digital music player etc 2 dies containing integrated circuits may be stacked vertically on a substrate they are internally connected by fine wires that are bonded to the package alternatively with a flip chip technology solder bumps are used to join stacked chips together a sip is like a system on a chip soc but less tightly integrated and not on a single semiconductor die 3 sip dies can be stacked vertically or tiled horizontally unlike less dense multi chip modules which place dies horizontally on a carrier sip connects the dies with standard off chip wire bonds or solder bumps unlike slightly denser three dimensional integrated circuits which connect stacked silicon dies with conductors running through the die many different 3d packaging techniques have been developed for stacking many fairly standard chip dies into a compact area 4 an example sip can contain several chips such as a specialized processor dram flash memory combined with passive components resistors and capacitors all mounted on the same substrate this means that a complete functional unit can be built in a multi chip package so that few external components need to be added to make it work this is particularly valuable in space constrained environments like mp3 players and mobile phones as it reduces the complexity of the printed circuit board and overall design despite its benefits this technique decreases the yield of fabrication since any defective chip in the package will result in a non functional packaged integrated circuit even if all other modules in that same package are functional sips are in contrast to the common system on a chip soc integrated circuit architecture which integrates components based on function into a single circuit die an soc will typically integrate a cpu graphics and memory interfaces hard disk and usb connectivity random access and read only memories and secondary storage and or their controllers on a single die whereas a sip would connect these modules as discrete components in one or more chip carrier packages a sip resembles the common traditional motherboard based pc architecture which separates components based on function and connects them through a central interfacing circuit board a sip has a lower grade of integration in comparison to a soc sip technology is primarily being driven by early market trends in wearables mobile devices and the internet of things which do not demand the high numbers of produced units as in the established consumer and business soc market as the internet of things becomes more of a reality and less of a vision there is innovation going on at the system on a chip and sip level so that microelectromechanical mems sensors can be integrated on a separate die and control the connectivity 5 sip solutions may require multiple packaging technologies such as flip chip wire bonding wafer level packaging and more 6 suppliers edit advanced micro devices amkor technology atmel ampak technology inc nanium s a ase group ceramicro chipsip technology cypress semiconductor stats chippac ltd toshiba renesas sandisk samsung silicon labs octavo systems nordic semiconductor jcet see also edit system on a chip soc hybrid integrated circuit hic references edit system in package sip solutions nepes www nepes co kr by pushkar apte w r bottoms william chen and george scalise ieee spectrum advanced chip packaging satisfies smartphone needs february 8 2011 retrieved july 31 2015 system in package sip a success story anysilicon february 21 2020 by r wayne johnson mark strickland and david gerke nasa electronic parts and packaging program 3 d packaging a technology review june 23 2005 retrieved july 31 2015 by ed sperling semiconductor engineering why packaging matters november 19 2015 retrieved march 16 2016 by tech search international and chip scale review staff chip scale review major osats positioned for growth opportunities in sip may june issue retrieved june 22 2016 v t e system on a chip soc components microprocessor cores controllers graphics processing unit gpu image processor media processor ai accelerator asic types network on a chip noc multiprocessor soc mpsoc programmable soc psoc microcontroller mcu alternatives multi chip module mcm system in a package sip package on a package pop related processor chronology design cpld digital signal processor dsp embedded systems fpga list of soc suppliers mobile computing unified memory retrieved from https en wikipedia org w index php title system_in_a_package oldid 1100001067 categories packaging microfabrication integrated circuits electronic design microtechnology computer systems hidden categories misleading articles articles needing additional references from february 2014 all articles needing additional references navigation menu personal tools not logged in talk contributions create account log in namespaces article talk english views read edit view history more search navigation main page contents current events random article about wikipedia contact us donate contribute help learn to edit community portal recent changes upload file tools what links here related changes upload file special pages permanent link page information cite this page wikidata item print export download as pdf printable version in other projects wikimedia commons languages azərbaycanca deutsch فارسی français nederlands 日本語 中文 edit links this page was last edited on 23 july 2022 at 18 34 utc text is available under the creative commons attribution sharealike license 3 0 additional terms may apply by using this site you agree to the terms of use and privacy policy wikipedia is a registered trademark of the wikimedia foundation inc a non profit organization privacy policy about wikipedia disclaimers contact wikipedia mobile view developers statistics cookie 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