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hbm ip solutions high bandwidth memory synopsys why synopsys solutions products support training resources search synopsys com contact sales contact sales search synopsys cancel popular content multiphysics fusion technology for multi die designs explained unified multiphysics fusion helps multi die teams validate earlier and sign off faster automotive executive guide rethinking automotive development a guide to virtualization in software defined vehicles for automotive leaders mastering ai chip complexity this ebook explores ai chip design trends challenges and strategies for first pass silicon success back our company careers ecosystem partners global offices investors leadership responsible business why synopsys our technology your innovation trusted industry leader learn more industry ai infrastructure automotive aerospace government edge ai data center mobile technology artificial intelligence cloud electronics digital twins energy efficient socs multi die design photonics optics multiphysics fusion technology for multi die designs explained unified multiphysics fusion helps multi die teams validate earlier and sign off faster download ebook by function analog design digital design design for test verification virtual prototyping hardware assisted verification signoff silicon lifecycle management manufacturing soc integration view all products synopsys ai ai enabled eda design automation insights ai powered optimization design verification test analog ai powered analytics design process control production genai 24 7 expert copilot agentic ai multi agent workflows eda fusion compiler synthesis implementation custom compiler analog custom ic design 3dic compiler multi die design primetime design signoff vcs logic simulation testmax ic test ic validator physical verification redhawk sc digital power integrity signoff system platform architect soc architecture exploration zebu ic emulation haps ic prototyping virtualizer virtual prototyping synplify complete fpga 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things hpc data center cloud 5g memory multi die solution rf design risc v about us newsroom community services support academic research alliances articles blogs careers demos events glossary partners success stories webinars authors synopsys converge synopsys ip interface ip foundation ip processor solutions interface ip subsystems security ip soc infrastructure ip accelerated solutions by market technical bulletin security options for arc processors star hierarchical system interface ip ccix cxl ddr die to die displayport ethernet ip hbm hdmi high speed serdes mipi embedded flash storage usb vesa dsc ip secure interfaces ip for tsmc n3e process pci express ualink ip solution ufs host controller ip synopsys 16g phy synopsys consumer 8g phy synopsys xaui phy ip synopsys 32g phy synopsys 6g phy synopsys die to die controller ip synopsys 10g phy complete ualink ip solution synopsys 25g phy synopsys 112g phy ip synopsys ccix controller ip hbm synopsys hbm2 2e ip solution synopsys hbm3 controller ip synopsys hbm3 phy ip synopsys hbm4 4e controller ip synopsys hbm4 phy ip synopsys hbm ip solution synopsys hbm ip solution high quality high bandwidth memory interface solution overview products resources get started synopsys offers a comprehensive hbm ip solution including controller phy and verification ip to meet the high bandwidth and low power memory requirements of multi die and system on chip soc designs targeting ai and high performance computing applications the synopsys hbm4 4e ip is the sixth generation of hbm ip featuring pin bandwidths of up to 12 gbps resulting in an overall interface bandwidth of over 3 tbps synopsys hbm3 3e and hbm2 2e ip have been validated in numerous designs and shipped in millions of chips enabling designers to minimize integration risk accelerate time to market and achieve first pass silicon success products hbm4 4e ip hbm4 4e controller ip hbm4 phy ip verification ip hbm3 ip hbm3 controller hbm3 phy verification ip hbm2 2e ip hbm2 2e phy verification ip resources blog world s first hbm4 ip test chip early silicon validation for next generation ai and hpc learn more blog hbm3 will feed the growing need for speed learn more blog what is edge computing and how is ai driving its growth learn more talk with an ip expert talk with an ip expert contact us ask synopsys beta ask synopsys ask ask synopsys beta this experience is in beta mode please double check responses for accuracy i notice you are interacting with an ai powered chatbot that provides general information about synopsys including its products and services which may be incorrect or incomplete in the event of any conflict or discrepancy the terms of your applicable agreements supersede any information provided by this chatbot these chats may be accessed by synopsys and its service providers to customize the experience and improve this tool and your use of this chatbot is an agreement to that data processing activity end chat closing this window clears your 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set to transform chip and product engineering introducing software defined hardware assisted verification a new benchmark for ai era chip design unveiling the synopsys electronics digital twin edt platform synopsys posts financial results for first quarter fiscal year 2026 nvidia and synopsys announce strategic partnership synopsys and ansys are now united learn what is an ai accelerator what is ai chip design what are chiplets what is eda what is edge ai what is edt what is an integrated circuit what is physical ai authors blogs english 日本語 简体中文 繁體中文 한국어 2026 synopsys inc all rights reserved privacy trademark brands security copyright