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leaned for optimal adhesion moderate to low thermal conductivity very low epoxy strong mechanical adhesion relatively inexpensive makes board rework difficult since it can damage component surface must be cleaned for optimal adhesion very low wire form z clips strong mechanical attachment easy removal rework applies a preload to the thermal interface material improving thermal performance requires holes in the board or solder anchors more expensive than tape or epoxy custom designs low clip on applies a preload to the thermal interface material improving thermal performance requires no holes or anchors easy removal rework must have keep out zone around the bga for the clip extra assembly steps low push pin with compression springs strong mechanical attachment highest thermal interface material preload easy removal and installation requires holes in the board which increases complexity of traces in pcb moderate stand offs with compression springs strongest mechanical attachment highest preload for the thermal interface material ideal for large heat sinks requires holes in the board which increases complexity of trace layout complicated assembly high thermal interface materials edit main article thermal interface material thermal conductivity and the interface resistance form part of the thermal interface resistance of a thermal interface material thermal contact resistance occurs due to the voids created by surface roughness effects defects and misalignment of the interface the voids present in the interface are filled with air heat transfer is therefore due to conduction across the actual contact area and to conduction or natural convection and radiation across the gaps 10 if the contact area is small as it is for rough surfaces the major contribution to the resistance is made by the gaps 10 to decrease the thermal contact resistance the surface roughness can be decreased while the interface pressure is increased however these improving methods are not always practical or possible for electronic equipment thermal interface materials tim are a common way to overcome these limitations properly applied thermal interface materials displace the air that is present in the gaps between the two objects with a material that has a much higher thermal conductivity air has a thermal conductivity of 0 022 w m k 20 while tims have conductivities of 0 3 w m k 21 and higher when selecting a tim care must be taken with the values supplied by the manufacturer most manufacturers give a value for the thermal conductivity of a material however the thermal conductivity does not take into account the interface resistances therefore if a tim has a high thermal conductivity it does not necessarily mean that the interface resistance will be low selection of a tim is based on three parameters the interface gap which the tim must fill the contact pressure and the electrical resistivity of the tim the contact pressure is the pressure applied to the interface between the two materials the selection does not include the cost of the material electrical resistivity may be important depending upon electrical design details selection based on interface gap 21 interface gap values products types available 0 05 mm 2 mil thermal grease epoxy phase change materials 0 05 0 1 mm 2 5 mil phase change materials polyimide graphite or aluminium tapes 0 1 0 5 mm 5 18 mil silicone coated fabrics 0 5 mm 18 mil gap fillers selection based on contact pressure 21 contact pressure scale typical pressure ranges product types available very low 70 kpa gap fillers low 140 kpa thermal grease epoxy polyimide graphite or aluminium tapes high 2 mpa silicone coated fabrics selection based on dielectric strength 21 electrical insulation dielectric strength typical values product types available not required n a n a n a thermal grease epoxy phase change materials graphite or aluminium tapes required low 10 kv mm 300 v mil silicone coated fabrics gap fillers required high 60 kv mm 1500 v mil polyimide tape tim application notes based on product type product type application notes thermal performance thermal paste messy labor intensive relatively long assembly time epoxy creates permanent interface bond phase change allows for pre attachment softens and conforms to interface defects at operational temperatures can be repositioned in field thermal tapes including graphite polyimide and aluminium tapes easy to apply some mechanical strength silicone coated fabrics provide cushioning and sealing while still allowing heat transfer gap filler can be used to thermally couple differing height components to a heat spreader or heat sink naturally tacky high power leds from philips lumileds lighting company mounted on 21 mm star shaped aluminium core pcbs light emitting diode lamps edit light emitting diode led performance and lifetime are strong functions of their temperature 22 effective cooling is therefore essential a case study of a led based downlighter shows an example of the calculations done in order to calculate the required heat sink necessary for the effective cooling of lighting system 23 the article also shows that in order to get confidence in the results multiple independent solutions are required that give similar results specifically results of the experimental numerical and theoretical methods should all be within 10 of each other to give high confidence in the results in soldering edit temporary heat sinks are sometimes used while soldering circuit boards preventing excessive heat from damaging sensitive nearby electronics in the simplest case this means partially gripping a component using a heavy metal crocodile clip hemostat or similar clamp modern semiconductor devices which are designed to be assembled by reflow soldering can usually tolerate soldering temperatures without damage on the other hand electrical components such as magnetic reed switches can malfunction if exposed to hotter soldering irons so this practice is still very much in use 24 methods to determine performance edit in general a heat sink performance is a function of material thermal conductivity dimensions fin type heat transfer coefficient air flow rate and duct size to determine the thermal performance of a heat sink a theoretical model can be made alternatively the thermal performance can be measured experimentally due to the complex nature of the highly 3d flow in present applications numerical methods or computational fluid dynamics cfd can also be used this section will discuss the aforementioned methods for the determination of the heat sink thermal performance a heat transfer theoretical model edit sketch of a heat sink with equivalent thermal resistances thermal resistance and heat transfer coefficient plotted against flow rate for the specific heat sink design used in 25 the data was generated using the equations provided in the article the data shows that for an increasing air flow rate the thermal resistance of the heat sink decreases one of the methods to determine the performance of a heat sink is to use heat transfer and fluid dynamics theory one such method has been published by jeggels et al 25 though this work is limited to ducted flow ducted flow is where the air is forced to flow through a channel which fits tightly over the heat sink this makes sure that all the air goes through the channels formed by the fins of the heat sink when the air flow is not ducted a certain percentage of air flow will bypass the heat sink flow bypass was found to increase with increasing fin density and clearance while remaining relatively insensitive to inlet duct velocity 26 the heat sink thermal resistance model consists of two resistances namely the resistance in the heat sink base r b displaystyle r_ b and the resistance in the fins r f displaystyle r_ f the heat sink base thermal resistance r b displaystyle r_ b can be written as follows if the source is a uniformly applied the heat sink base if it is not then the base resistance is primarily spreading resistance r b t b k a b displaystyle r_ b frac t_ b ka_ b 4 where t b displaystyle t_ b is the heat sink base thickness k displaystyle k is the heat sink material thermal conductivity and a b displaystyle a_ b is the area of the heat sink base the thermal resistance from the base of the fins to the air r f displaystyle r_ f can be calculated by the following formulas r f 1 n h f w f t f 2 η f l f displaystyle r_ f frac 1 nh_ f w_ f left t_ f 2 eta _ f l_ f right 5 η f tanh m l c m l c displaystyle eta _ f frac tanh ml_ c ml_ c 10 6 m l c 2 h f k t f l f displaystyle ml_ c sqrt frac 2h_ f kt_ f l_ f 10 7 d h 4 a c h p c h displaystyle d_ h frac 4a_ ch p_ ch 8 r e 4 g ρ n π d h μ displaystyle re frac 4 dot g rho n pi d_ h mu 9 f 0 79 ln r e 1 64 2 displaystyle f 0 79 ln re 1 64 2 27 10 n u f 8 r e 1000 p r 1 12 7 f 8 0 5 p r 2 3 1 displaystyle nu frac f 8 re 1000 pr 1 12 7 f 8 0 5 pr frac 2 3 1 27 11 h f n u k a i r d h displaystyle h_ f frac nuk_ air d_ h 12 ρ p a t m r a t i n displaystyle rho frac p_ atm r_ a t_ in 13 the flow rate can be determined by the intersection of the heat sink system curve and the fan curve the heat sink system curve can be calculated by the flow resistance of the channels and inlet and outlet losses as done in standard fluid mechanics text books such as potter et al 28 and white 29 once the heat sink base and fin resistances are known then the heat sink thermal resistance r h s displaystyle r_ hs can be calculated as r h s r b r f displaystyle r_ hs r_ b r_ f 14 using the equations 5 to 13 and the dimensional data in 25 the thermal resistance for the fins was calculated for various air flow rates the data for the thermal resistance and heat transfer coefficient are shown in the diagram which shows that for an increasing air flow rate the thermal resistance of the heat sink decreases experimental methods edit experimental tests are one of the more popular ways to determine the heat sink thermal performance in order to determine the heat sink thermal resistance the flow rate input power inlet air temperature and heat sink base temperature need to be known vendor supplied data is commonly provided for ducted test results 30 however the results are optimistic and can give misleading data when heat sinks are used in an unducted application more details on heat sink testing methods and common oversights can be found in azar et al 30 numerical methods edit radial heat sink with thermal profile and swirling forced convection flow trajectories predicted using a cfd analysis package in industry thermal analyses are often ignored in the design process or performed too late when design changes are limited and become too costly 9 of the three methods mentioned in this article theoretical and numerical methods can be used to determine an estimate of the heat sink or component temperatures of products before a physical model has been made a theoretical model is normally used as a first order estimate online heat sink calculators 31 can provide a reasonable estimate of forced and natural convection heat sink performance based on a combination of theoretical and empirically derived correlations numerical methods or computational fluid dynamics cfd provide a qualitative and sometimes even quantitative prediction of fluid flows 32 33 what this means is that it will give a visual or post processed result of a simulation like the images in figures 16 and 17 and the cfd animations in figure 18 and 19 but the quantitative or absolute accuracy of the result is sensitive to the inclusion and accuracy of the appropriate parameters cfd can give an insight into flow patterns that are difficult expensive or impossible to study using experimental methods 32 experiments can give a quantitative description of flow phenomena using measurements for one quantity at a time at a limited number of points and time instances if a full scale model is not available or not practical scale models or dummy models can be used the experiments can have a limited range of problems and operating conditions simulations can give a prediction of flow phenomena using cfd software for all desired quantities with high resolution in space and time and virtually any problem and realistic operating conditions however if critical the results may need to be validated 1 pin fin heat sink with thermal profile and free convection flow trajectories predicted using a cfd analysis package 38 mm diameter by 50 mm tall pin fin heat sink with thermal profile and swirling animated forced convection flow trajectories from a vaneaxial fan predicted using a cfd analysis package 60 mm by 60 mm by 10 mm straight finned heat sink with thermal profile and swirling animated forced convection flow trajectories from a tubeaxial fan predicted using a cfd analysis package see also edit computer cooling heat spreader heat pipe heat pump thermal conductivity of diamond radiator thermal interface material thermal management electronics thermal resistance thermoelectric cooling references edit 1 2 3 4 5 6 kordyban t 1998 hot air rises and heat sinks everything you know about cooling electronics is wrong asme press isbn 978 0 7918 0074 4 1 2 3 nello sevastopoulos et al national semiconductor voltage regulator handbook national semiconductor corp 1975 chapters 4 5 6 type 2n3055 n p n single diffused mesa silicon power transistor data sheet texas instruments bulletin number dl s 719659 august 1967 revised december 1971 khan junaid momin syed abdul mariatti m 30 october 2020 a review on advanced carbon based thermal interface materials for electronic devices carbon 168 65 112 bibcode 2020carbo 168 65k doi 10 1016 j carbon 2020 06 012 s2cid 224932456 1 2 3 anon unknown heat sink selection archived 2012 03 05 at the wayback machine mechanical engineering department san jose state university 27 january 2010 aluminium matter organization uk archived from the original on 2010 04 11 retrieved 2010 04 04 copper heatsinks cooliance archived from the original on 2014 10 11 heatsink design and selection material abl heatsinks 1 2 3 sergent j krum a 1998 thermal management handbook for electronic assemblies first ed mcgraw hill 1 2 3 4 5 6 7 incropera f p and dewitt d p 1985 introduction to heat transfer john wiley and sons ny yovanovich m muzychka y culham j 1998 01 12 spreading resistance of isoflux rectangles and strips on compound flux channels 36th aiaa aerospace sciences meeting and exhibit aerospace sciences meetings american institute of aeronautics and astronautics doi 10 2514 6 1998 873 retrieved 2025 07 12 lee seri moran kevin 1995 constriction spreading resistance model for electronics packaging proceedings of the 4th asme jsme thermal engineering joint conference 4 forghan f goldthwaite d ulinski m metghalchi m 2001 experimental and theoretical investigation of thermal performance of heat sinks isme may lasance c j m and eggink h j 2001 a method to rank heat sinks in practice the heat sink perform...
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