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index html frontier semiconductor fsm application series product contact us inquiry login fsm application series product contact us inquiry login welcome to frontier semiconductor frontier semiconductor usa has moved our new address is 165 topaz st milpitas ca 95035 our phone number remained 1 408 432 8838 frontier semiconductor fsm offers a range of advanced metrology products and solutions for semiconductor led solar fpd data storage and mems applications we have over 25 years experience in stress measurement film adhesion testing wafer topography metrology and electrical characterization our latest offerings include unique technology to meet the metrology needs of 3dic manufacturing and to monitor stress of large flat panels fsm has local sales and support offices in all major semiconductor clusters other areas are covered by a network of local representatives applications domains technologies fsm offers metrology and characterization systems for front end back end as well as research and development applications film stress film adhesion 3dic tsv process control thin wafer metrology electrical characterization low coherence interferometry laser scanning applications technologies series click here to see all series electrical characterization contact and non contact sheet resistance measurement systems for implantation diffusion metallization and many other applications 4pp 128 series frontier semiconductor is the leading manufacturer of stress measurement tools for semiconductor mems optoelectronic and flat panel applications stress and wafer bow maps can be acquired over the entire wafer surface providing process engineers means to characterize and develop new processes using different thin film materials the fsm 128 series systems are room temperature full wafer 2d 3d stress mapping systems 128 systems use fsm s patented non contact opti lever dual laser auto switching technology featuring a micropositioning detector to measure the laser beam deflection with high precision over a large dynamic range of small to large bow or stress fsm s stress gauges have the ability to scan 1000 points per inch in seconds for high resolution high precision stress mapping on blanked and patterned wafers 128l c2c 128l 128nt 128g 450 128 c2c 128 fpd 413 series substrate and tape total and individual thicknesses warpage and ttv measurement able to measure with or without backing tape for wafer back grind and etch thinning processes control non contact echoprobe or vite technology thin film and surface roughness options 413 c2c 413 sa 413mot 900 series stress hysteresis in vacuum or gas up to 900c for the study of annealing cycles thermal desorption film shrinkage reflectivity and resistivity options provide additional insight to causes of material changes with temperature new optional wafer rotation offers unique 2d 3d mapping to study wafer deformation as a function of temperature 900 c2c 900tc vac 500 series stress hysteresis measurement up to 500c for thermal property and stability tests of thin films in inert gas non contact laser scanning technology 500tc adhesion testers film adhesion testing of thin films and stacks on substrates for material evaluation melt aquaflex products 15 product lines click here for more details 413 c2c 413 series thickness and total thickness variation ttv mapping system ttv and thickness of wafer substrate thick layers wafers on tape bonded wafers etc fully automated cassette to cassette system secs gem compliant warp roughness and thin film thickness measurement options 128l c2c 128 series dedicated film stress mapping system with high resolution for high throughput process control fully automated cassette to cassette secs gem compliant 300mm film stress and bow measurement tool dual or single foup configurations available integrated wafer substrate thickness measurement available 900 c2c 900 series rapid thermal mechanical characterization of novel materials simulataneous extraction of stress hysteresis thermal desorption film shrinkage and reflectivity data during thermal cycling in vaccum up to 900 degree c fully automated cassette to cassette system for 300mm wafers secs gem option contact us north america frontier semiconductor corporate head office tel 1 408 432 8838 fax 1 408 232 1115 fsm100 frontiersemi com 165 topaz st milpitas ca 95035 fsm europe adrian cailean sales service tel 33 0 676 494 487 fax 33 0 4 76 35 77 61 adrianc frontiersemi com 196c rue du rocher de lorzier 38430 moirans france fsm korea shawn sung hyun kwon sales service tel 82 31 8015 5458 fax 82 31 8015 5459 shawnk frontiersemi com 310 dongtan paragon ii 106 1 bansong dong hwasung si gyeonggi do korea 18455 fsm taiwan phillies wu sales service tel 886 3 658 7061 886 928 810 128 fax 886 3 658 9600 phillieswu frontiersemi com 4f no 156 sec 1 wenxing rd chupei city hsinchu county 30264 taiwan r o c fsm china cherry tang sales service tel 86 189 5515 4480 fax cherryt frontiersemi com 618 building 1 58 xiangke road shanghai pilot free trade zone china 201210 fsm china sales representative tony huang sales service tel 86 20 83295780 fax 862083295780 admin apolloswing com room 2906 fu li ying feng building no 2 huaqiang road tianhe district guangzhou china 510623 fsm bangladesh rashidul hasan sales service tel 880 1795892136 fax fsmblog frontiersemi com level a 12 tower 71 ecb chattar dhaka 1206 bangladesh miwaopto ミワオプト株式会社 kazuo yabuuchi 薮内 一雄 sales service tel 81 03 5742 2181 fax 81 03 5742 2188 kyabuuchi miwaopto co jp email inquiry name company country email to reply phone mobile interested in product product 128 series 413 series 500 series 900 series adhesion testers electrical characterization application application 3dic tsv process control electrical characterization film adhesion film stress laser scanning low coherence interferometry thin wafer metrology subject message copyright 2016 frontier semiconductor login fsm